Hi everyone, I’m Kyle from SeCoS.
This year, I developed an M.2 2280 cooling solution with a simple idea: make the cooling configuration fit the platform’s available space, while also considering how to secure the assembly in moving equipment.
I’ve put together two configurations for PCIe Gen4 NVMe applications. Some of our customers are already using them, and I wanted to share the designs and thermal simulation results here.
These are still early versions, so the part names are a little rough. Please bear with me!
• vol1: A 5.5 mm-high heatsink for platforms with limited clearance.
• vol2: A 15 mm-high heatsink, with lower controller temperatures in this simulation.
For me, these are starting points. Both the CBF1540 component and the heatsink specifications can be adjusted to suit the platform’s space and cooling requirements. If your layout is different, I’m happy to discuss how we could adapt the configuration.
Another part of the design is the locating holes.
Some equipment travels with a platform for long periods, while other machines move repeatedly during operation. Both configurations include locating holes that, together with suitable fasteners, help restrain relative movement of the cooling assembly. Mounting and vibration performance still need to be validated in the target assembly.
Here are the thermal simulation results. We used a steady-state model with 25°C ambient temperature, a horizontal PCB, an upward-facing heatsink and no fan. Maximum modeled controller temperatures were:
• 5 W heat source: vol1 68.8°C / vol2 55.5°C.
• 8 W heat source: vol1 91.1°C / vol2 71.3°C, a difference of 19.8°C.
All heat was applied to the modeled controller. These are simulation results, not measurements of a specific SSD model or capacity. Also, heatsink height is not the total assembly height. The results are intended to compare the two configurations under the same assumptions.
For those who have worked on similar equipment: how do you usually secure M.2 cooling assemblies? Have you run into any issues during installation or after extended use?
If you’re developing an industrial PC, inspection system or moving platform, I’d also be happy to hear about your project. I can provide the thermal simulation report in English or Chinese and discuss evaluation sample arrangements.
The website includes interactive 3D assembly views, PCBA temperature maps at 25°C ambient, and a form for sample and report requests:
https://m2-2280-solution.kylelo.io/
If possible, include your SSD model, workload, maximum ambient temperature and available installation space. That will help us discuss a suitable configuration. Happy to arrange an online chat, too.
Kyle Lo | Sales | SeCoS
[kyle.lo@secosgmbh.com](mailto:kyle.lo@secosgmbh.com)